Mechanical Engineer – Consumer Electronics R&D

About the role

Quectel Wireless Solutions is expanding its R&D centre in Serbia and seeks a Mechanical Engineer to lead the structural design of consumer‑electronics products such as IoT modules, smartphones and POS terminals. The role combines feasibility studies, component selection, detailed design and support through mass‑production launch.

Key responsibilities

• Assess technical feasibility of product structures against definitions and industry standards, identifying risks and mitigation plans.
• Select mechanical and electronic components based on hardware requirements, cost, and manufacturability.
• Lead stack‑up and overall mechanical architecture, coordinating design reviews with cross‑functional teams.
• Produce technical documentation including limit drawings, assembly flow charts, exploded views, DFM reports and BOMs.
• Build and validate hand‑made prototypes, conduct mold DFM reviews, oversee mold fabrication, trial molding and sample approval.
• Monitor assembly processes during mass‑production launch, troubleshoot trial‑production issues and provide corrective solutions.
• Define and continuously improve technical standards and design specifications.
• Perform any additional tasks assigned by supervisors.

Required profile

• Bachelor’s degree or higher in Mechanical Engineering or a related field.
• Minimum 5 years of experience in consumer‑electronics mechanical design, preferably with mobile phones or POS terminals.
• Strong knowledge of mechanical principles, GD&T and tolerance analysis.
• Experience with design‑for‑assembly, stamping, injection molding, die‑casting and surface‑treatment processes.
• Proven ability to manage complex projects and mentor junior engineers.
• Excellent teamwork and technical knowledge‑sharing skills.

Required skills

• Mechanical design and CAD (3D/2D) software.
• Geometric Dimensioning & Tolerancing (GD&T).
• Tolerance analysis.
• Design for Assembly (DFMA) techniques.
• Stamping, plastic injection molding and die‑casting.
• Surface‑treatment processes.
• Bill of Materials (BOM) creation and management.
• Prototype assembly and mold DFM review.